Coating apparatus/Surface processing device/Related product |
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The LS-322L delivers the same results as conventional products but faster at lower cost [Features] • Treatment can be done much faster • Long product life, contributing to overall reduction of running cost • Can be applied to continuous plating facilities
Target industry: Metallic Products/Parts Electrical/Electronic Parts
The MEOX is a highly effective product for improving copper surface quality. [Features] • Removes deposits generated by the pre-plating process on copper surfaces • Maintains the active surface even after the main plating process • Enables control of the correct etching amount
Target industry: Metallic Products/Parts Electrical/Electronic Parts
The SN-500 creates a uniformly shiny appearance thanks to its wide current density area. [Features] • Wide current density area, from low to high, contributes to uniformly shiny appearance • Ideal for applications requiring larger currency distribution areas, such as PCBs • Suitable for products of different sizes and uses, from continuous plating to barrel plating facilities
Target industry: Metallic Products/Parts Electrical/Electronic Parts
Murata’s SN Con 185 is a high-purity concentrated nickel sulfamate solution used in various fields, such as decorative plating and production of electronic parts, electroformed parts, diamond tools, etc. Murata has a wide variety of additives for nickel sulfamate electroplating cells to enhance many different plating properties, such as hardness, flexibility, internal stress, etc. [Features] • Generates high-purity uniform deposition with low internal stress • Can be applied with high concentration and high current density • Enables high-speed plating
Target industry: Metallic Products/Parts Electrical/Electronic Parts
Removal of residues, surface reforming, and ashing of φ4 to 6 inch wafers is possible by using this new plasma cleaner. The automatic conveying mechanism contributes to prevention of wafer cracking and reduction of personnel expenses and operation time due to wafer transfer. In addition, the process chamber achieves high throughput by simultaneous processing of two wafers. 【Features】 ■Compact design:1400(W)×3000(D)×1900(H)mm ■Distribution:± 5% or less in a wafer ■Ultra-thin piezoelectric wafers such as SAW device ■Ar plasma cleaning (option) ※Please see the document for details. Please do not hesitate to contact us.
Target industry: Electrical/Electronic Parts Semiconductors/LCD/FPD Automotive Parts
This Arc-discharge-type ion plating equipment "SIA-400T" is most suitable and the state of art system for "surface cured coating films and decortive film" for tools, blades and molds.
Target industry: Electrical/Electronic Parts Machine Parts Metallic Products/Parts
ALD (Atomic Layer Deposition) forms a thin film by repeating cycles of the Atomic Layer Deposition method that forms a single atomic layer in one cycle. Enabling uniform layer control at an atomic layer level can form a thin film with high quality as well as high step-coverage.
Target industry: Electrical/Electronic Parts Optical Equipment/Parts Resin/Plastic/Rubber Products
Showa Shinku's Ion Plating Equipment using Hollow Cathode System"SIHー400T" is most suitable to form decorative films for accessories and cured coating films for tools.
Target industry: Automotive Parts Machine Parts Metallic Products/Parts
The new developed sputtering and polymerization system integrated with injection molding system SPP-SERIES enables fully automatic formation of metallic and protective films on resin substrates used in the automobile and decoration industries.
Target industry: Automotive Parts Metallic Products/Parts Resin/Plastic/Rubber Products
Showa Shinku's Ion Plating Equipment "SIP-1600" is that the customers considering dried ornaments/painting can form a metal film on the resin substrate
Target industry: Automotive Parts Metallic Products/Parts Resin/Plastic/Rubber Products