Asia wide Manufacturing Business Platform in Malaysia

TECH DIRECTORY Malaysia

Package PCB

Package PCB

【Key technology】
○ Suitable material choice for less warpage for package PCB
○ L/S=25/25μ High-density circuit formation technology
○ Reliable surface treatment technology
○ Film solder resist method to achive better yield for C4 assembly, is available.

※ Specification is in the catalog
※ For details, please contact us or download our catalog

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Price

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Estimated delivery time

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Stock in Malaysia

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Target industry

Consumer Electrical Appliances  Information/Communication Devices  Medical Instruments

Company information

SATOSEN CO.,LTD. SATOSEN CO.,LTD.

Products and services features

PCB for flip chip package
【Advantages】
○ L/S=25/25μ High-density circuit formation technology
○ In our know-how of pattern design and manufacturing, we ensure the high connection reliability of flip-chip mounting
○ We use film solder resist to eliminate any trouble during flip-chip mounting

Catalogue

Satosen CO.,LTD

Inquiry

Language

English Japanese

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Category

Pick-up

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